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In Reply to: Re: SACD1000 UPDATE posted by Alex Peychev on August 23, 2003 at 21:11:49:
Alex,When you reflowed the solder the first time, you may not have fixed all the bad connections. Moving a new chip over to the old processor, you had to really solder all the connections. Have you tried moving the "broken" chip to a working machine, and seeing what happens?
Heastsink paste under the chip probably isn't doing you much for heat dissipation, given the solder mask, and the fact that heat rises. Given sufficient ground pins, there's probably more heat conduction through the pins than the plastic body. Heatsink and paste on top is a good precautionary thing to do.
--Andre
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Follow Ups
- Re: SACD1000 UPDATE - Andre Yew 08/24/0311:19:40 08/24/03 (1)
- Re: SACD1000 UPDATE - Alex Peychev 11:50:43 08/24/03 (0)
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