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Re: Its Alive! Its Alive!

Aluminum does it on integrated circuits, apparently the electrons carry (drag, bounce, who knows) the metal along the current direction. That limits current density for the on chip interconnects.

Pure tin plating grows whiskers, filaments that grow upwards off the surface. Major hybrid failure mechanism way back.

Did you mean movement WHILE it's in the 'scope?

TTFN, John


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