In Reply to: Its Alive! Its Alive! posted by rcrump on November 6, 2002 at 21:26:25:
Aluminum does it on integrated circuits, apparently the electrons carry (drag, bounce, who knows) the metal along the current direction. That limits current density for the on chip interconnects.Pure tin plating grows whiskers, filaments that grow upwards off the surface. Major hybrid failure mechanism way back.
Did you mean movement WHILE it's in the 'scope?
TTFN, John
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Follow Ups
- Re: Its Alive! Its Alive! - John Escallier 11/7/0214:41:19 11/7/02 (9)
- Re: Its Alive! Its Alive! - john curl 15:41:14 11/7/02 (8)
- Re: Its Alive! Its Alive! - John Escallier 16:25:39 11/7/02 (7)
- Re: Its Alive! Its Alive! - john curl 17:20:10 11/7/02 (6)
- John, what are you talking about??? I really think you should read the posts. - John Escallier 22:35:24 11/7/02 (0)
- Re: Its Alive! Its Alive! - john curl 17:56:49 11/7/02 (4)
- Hmmmm.....tick tock, tick, tock - John Escallier 22:59:25 11/7/02 (3)
- Re: Hmmmm.....tick tock, tick, tock - john curl 01:02:40 11/8/02 (2)
- neat info. - John Escallier 04:43:22 11/8/02 (1)
- Re: neat info. - john curl 13:57:19 11/9/02 (0)